Wintech to Participate in Warsaw Pack 2026 in Poland

Wintech is excited to confirm its participation in Warsaw Pack 2026, an international trade fair focused on packaging technology and equipment. The exhibition will be held in Warsaw, Poland, from April 14–16, 2026.

The event will take place at the exhibition center at Aleja Katowicka 62, 05-830 Nadarzyn. Wintech will be located at Booth E1.14C, and visitors are welcome to stop by to meet the team and discover the company’s latest innovations in packaging machinery.

Specializing in stretch film machinery and related equipment, Wintech continues to upgrade its technologies to meet the evolving needs of the global packaging industry. The company is committed to delivering stable machine performance, high production efficiency, and long-term reliability—helping customers achieve consistent output and cost-effective production.

As one of Europe’s key industry platforms, Warsaw Pack brings together manufacturers, suppliers, and buyers from a wide range of sectors. Through this event, Wintech aims to further expand its presence in the European market and strengthen relationships with partners and customers across the region.

Throughout the exhibition, the Wintech team will be on-site to share detailed information about its equipment solutions and discuss practical applications for stretch film production and packaging operations.

Wintech warmly invites visitors, partners, and industry professionals to Booth E1.14C at Warsaw Pack 2026. We look forward to meeting you in Warsaw and exploring future cooperation opportunities.